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INTEGRATED CIRCUITS
DATA SHEET
TDA3629 Light position controller
Product specification File under Integrated Circuits, IC18 1996 Sep 04
Philips Semiconductors
Product specification
Light position controller
FEATURES * Low positional error * Low noise sensitivity due to hysteresis * Low supply current * Thermally protected * Broken wire and short-circuit indication on SET input * Brake function by short-circuiting the motor * Hysteresis level set externally. QUICK REFERENCE DATA SYMBOL IP(ss) IP - Im Vm Im ISET Note 1. Steady state implies that the motor is not running (Im = 0) and VSET = VFB = 0.5VP. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA3629 TDA3629T DIP8 SO16 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 16 leads; body width 3.9 mm PARAMETER supply current, steady state supply current, motor active output voltage output current motor switch on current level note 1 Im < 900 mA Im < 700 mA VP 12.3 V VP = 12 V CONDITIONS MIN. - - TYP. - - GENERAL DESCRIPTION
TDA3629
The Light position controller (Leucht Weiten Steller, LWS) is a monolithic integrated circuit intended to be used in passenger cars. This device adapts the elevation of the light beam of the head light of the car to a state defined by the car driver using a potentiometer on the dashboard.
MAX. 6 80 - - 12
UNIT mA mA V mA A
VP - 2 - .9 670 6 - 9
VERSION SOT97-1 SOT109-1
1996 Sep 04
2
Philips Semiconductors
Product specification
Light position controller
BLOCK DIAGRAM
TDA3629
VP1
handbook, full pagewidth
VP2
2(5) PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE
7(12)
SUPPLY
TDA3629
SHORT-CIRCUIT ISET BROKEN WIRE SET 8(16) VP
3(6) INPUT STAGE
OUT1
FB
1(1) ISET
WINDOWS AND COMPARATORS
OUTPUT STAGES VP 6(11)
OUT2
Iref 5(9)
MGE632
Pin numbers in parenthesis represent the TDA3629T.
Fig.1 Block diagram.
1996 Sep 04
3
Philips Semiconductors
Product specification
Light position controller
PINNING PIN SYMBOL TDA3629 FB VP1 OUT1 n.c.(1) GND OUT2 VP2 SET Note 1 2 3 4 5 6 7 8 1 5 6 2 to 4, 7, 8, 10, 13 to 15 9 11 12 16 TDA3629T feedback input supply voltage 1 output 1 not connected ground output 2 supply voltage 2 set input
TDA3629
DESCRIPTION
1. The pins which are not electrically connected should be connected to a copper area of the printed-circuit board which is as large as possible to improve heat transfer.
handbook, halfpage
FB n.c.
handbook, halfpage
1 2 3 4
16 SET 15 n.c. 14 n.c. 13 n.c.
FB VP1 OUT1 n.c.
1 2
8 7
SET VP2 OUT2 GND
n.c. n.c. VP1 OUT1 n.c. n.c.
TDA3629
3 4
MGE633
TDA3629T
5 6 7 8
MGE634
6 5
12 VP2 11 OUT2 10 n.c. 9 GND
Fig.2 Pin configuration TDA3629.
Fig.3 Pin configuration TDA3629T.
1996 Sep 04
4
Philips Semiconductors
Product specification
Light position controller
FUNCTIONAL DESCRIPTION The device is intended to control the elevation of the light beam of a head light of a passenger car. The driver can control the elevation of the light beam by rotating a potentiometer on the dashboard (the setting potentiometer). The device adapts the elevation of the light beam by activating the control motor. The elevation of the head light is fed back to the device by a second potentiometer (the feedback potentiometer). This feedback potentiometer is mechanically coupled to the motor. The device operates only when the supply voltage is within certain limits. The device is switched off outside these boundaries. The under voltage detection detects whether the supply voltage is below the under voltage threshold. The motor will not be activated when this occurs, but it remains short-circuited by the output stages. The over voltage will switch off the total device when the supply voltage is higher than the over voltage threshold. A thermal protection circuit becomes active if the junction temperature exceeds a value of approximately 160 C. This circuit will reduce the motor current, which will result in a lower dissipation and hence a lower chip temperature. This condition will only occur when the motor is blocked at high ambient temperature. A detection of a broken wire of the slider of the setting potentiometer is included because it will be connected to the device by a wire several meters long. This detection circuit prevents the motor from rotating when the wire is broken. In this event the brake will remain active. The protection of VSET to VP circuit prevents the motor from rotating when the voltage at the VSET input is above the threshold value. This can be used to detect whether the wire from the slider of the setting potentiometer is short-circuited to the battery line. A protection of VSET short-circuited to ground is also present. The motor will be stopped if VSET becomes lower than the threshold level. The shaded areas in Fig.4 represent the parts where the short-circuit protection stages are active. Figure 4 shows that a position of 0 mm can not be reached, neither can a position of 100%. The minimum position that can be reached depends on the battery voltage Vb, although the maximum position does not.
TDA3629
handbook, halfpage
MGE635
100 position (%)
0 0 VSET(min) VSET(max) Vb
VSET (V)
Fig.4 Conversion gain.
The device is protected against electrical transients which may occur in an automotive environment. The device will shut off when positive transients on the battery line occur (see Figs 7 and 8). The motor will not be short-circuited in this event. The flyback diodes, illustrated in Fig.1, will remain present. The state of the output stages at the moment when the transient starts is preserved by internal flip-flops. Negative transients on the battery line (see Figs 7 and 8) will result in a set short-circuited to ground fault detection, because it will result in a voltage at the setting input which is below the short-circuited to ground threshold. The device however discharges the electrolytic capacitor during these transients. It will stop functioning when the resulting supply voltage becomes too low.
1996 Sep 04
5
Philips Semiconductors
Product specification
Light position controller
The timing can be divided into several parts starting from a steady state (see Fig.5, the starting point, and Fig.10 for the application diagram): in this state (until T1) a large reference current is active, indicated by the dotted lines. When the setting potentiometer is rotated (started at T1 and indicated by VSET) and the input current ISET becomes higher than the reference current Iref (at time T2), the motor will start and the input current will decrease. At the same time the reference current is switched to a low level. During rotation of the motor the input current will decrease until it becomes lower than this low reference current;
TDA3629
this occurs at time T4. At this time the brake becomes active, the motor will stop and the reference current is set to the higher value. The brake is realized by short-circuiting the motor. In general: this system does not use a linear adaptation strategy but an on-off strategy. This results in high accuracy and low noise sensitivity. The brake is active at any time during normal operation when the motor is not active. The polarity of the feedback potentiometer should be such that the voltage at the slider of the feedback potentiometer increases when OUT1 is high and OUT2 is low.
handbook, full pagewidth
V2 VSET
V1 V2 VFB
V1
ISET 0 Iref
absolute motor current 0 T1 T2 T3 T4 time
MGE636
Fig.5 Timing diagram.
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
TDA3629
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). All voltages are defined with respect to ground. Positive currents flow into the device. Values measured in Fig.10. SYMBOL VP Vn Ves Tstg Tamb Tvj Vb, tr RL tblock Notes 1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k resistor. 2. In accordance with IEC 747-1. An alternative definition of virtual junction temperature Tvj is: Tvj = Tamb + Pd x Rth vj-amb, where Rth vj-amb is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation Pd and ambient temperature Tamb. Additional information is given in section "Thermal aspects" in chapter "Test and application information". 3. Wave forms illustrated in Figs 7 and 8 applied to the application diagram, Fig.10. 4. Vb = 13 V; Tamb = 25 C; duration 50 ms maximum; non repetitive. THERMAL CHARACTERISTICS In accordance with IEC 747-1. SYMBOL Rth vj-amb TDA3629 TDA3629T PARAMETER thermal resistance from junction to ambient in free air 100 105 K/W K/W VALUE UNIT PARAMETER supply voltage voltage on any other pin electrostatic handling storage temperature ambient temperature virtual junction temperature voltage transients on Vb load resistance cumulative blocking time note 2 note 3 note 4 Im = 700 mA note 1 CONDITIONS operating non-operating 8 -0.3 -0.3 -3 -55 -40 -50 -150 10 - MIN. MAX. 18 +50 VP + 0.3 +3 +150 +105 +150 +100 - 100 V V V kV C C C V h UNIT
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
TDA3629
CHARACTERISTICS VP = 12 V; RL = 14 . All voltages are defined with respect to ground. Positive currents flow into the device. Values measured in Fig.10 with RSET = RFB = 20 k; unless otherwise specified. SYMBOL Supply VP(min) VP(max) IP(ss) IP - Im under voltage threshold over voltage threshold supply current, steady state supply current, motor active Tamb = 25 C Tamb = -40 to +105 C note 1 Im < 400 mA; note 2 Im < 900 mA; note 2 Setting input (SET) VSET ISET VSET(sc) operating voltage input current wire short-circuited to ground threshold wire short-circuited to battery threshold VSET VFB IFB(max) Vm broken ground set pull-up Feedback input (FB) voltage maximum input current RFB > 20 k Im < 700 mA; Tamb = 25 C; note 2 Im < 700 mA; Tamb = -40 to +105 C; note 2 Im output current VP 12.3 V; Tamb = 25 C; note 2 VP 12.3 V; Tamb = -40 to +105 C; note 2 Reference current ISET motor switch-on level motor switch-off level VP = 12 V VP = 18 V 6 9 - 9 13 2.5 12 17 - A A A 1.5 -250 - - 0.95VP +250 - - V A RSET > 20 k output stages switched off output stages switched off note 3 1.5 -250 - VP - - - - - - 0.95VP +250 1 - 160 V A V V mV 6 18 17.5 - - - - - - - - - 8 22 22.8 6 40 80 V V V mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Motor outputs output voltage VP - 2.9 - VP - 3.4 - V V
670 635
- -
- -
mA mA
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
Notes to the characteristics 1. Steady state implies that the motor is not running (Im = 0) and VSET = VFB = 0.5VP. 2. This is only valid when the temperature protection is not active.
TDA3629
3. VSET is the difference in voltage on the set potentiometer between the situation when the ground wire is interrupted (VSET, br) and voltage on the set potentiometer during normal operation (when VSET = 0.17Vb = 2.72 V). The conditions for this test are: RSET = 20 k; Vb = 16 V; VSET = VSET, br - 2.72 V; see Fig.6.
handbook, halfpage
+Vb
battery 830 390 REMAINDER OF MODULE RSET ground
+
170 VSET, br
-
ground wire not connected
MGE637
The 170 , 830 and 390 resistors form the setting potentiometer in its worst case position. The given situation (combination of Vb, RSET and the position of the set potentiometer) forms the worst case situation. The given maximum of VSET guarantees that any other module, connected to the same set potentiometer, will not start to activate its motor, when its motor switch-on level is higher than 0.01Vb (RSET 20 k).
Fig.6 Conditions for the test of note 3.
QUALITY SPECIFICATION The quality of this device is in accordance with "SNW-FQ-611 part E". The numbers of the quality specification can be found in the "Quality reference Handbook". The handbook can be ordered using the code 9397 750 00192.
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
TEST AND APPLICATION INFORMATION Automotive transients
TDA3629
handbook, halfpage
112 Vb (V) PULSE 2 2 ms 12 0 0.5 ms
time
PULSE 1 -88
MGE638
Fig.7 Worst case transients on Vb (continued in Fig.8).
Worst case transients that may occur on the battery line Vb of the application (see Fig.10), are the pulses whose wave forms and the corresponding values are as illustrated in Figs 7 and 8. The signal source which generates these pulses (numbered pulses 1 and 2) has a series resistance (Ri) of 10 . These pulses represent for instance the influence of switching of inductors on the battery line. The signal source which generates pulses 3 and 4 has a series resistance of 50 . These pulses represent for instance the influence of ignition on the battery line. Their repetition rate is 100 ms.
handbook, full pagewidth
90 ms pause 112 Vb (V) PULSE 3
10 ms 100 s 12 0 100 s 10 ms
time
PULSE 4
90 ms pause
MGE639
-138
Fig.8 Worst case transients on Vb (continued from Fig.7).
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
Application diagrams and additional information Two possible application diagrams are shown. The first (see Fig.9) shows the best case: the lowest component count. The second (see Fig.10) shows additional components which may be necessary. Two capacitors are added to meet EMC requirements (one on the VP pins, the second one between the set and feedback input pins). A third capacitor has been added across the motor to suppress current spikes. The given values of these capacitors have to be optimized by experiments carried out on the total application. The resistors do not have to have the same value. The voltage hysteresis is set by means of RSET.
TDA3629
The resistor in the feedback input line (RFB) is present to limit the current during the transients as illustrated in Figs 7 and 8. This resistor should have a value larger than 2 k. RSET can be chosen freely but must also be larger than 2 k. A diode is placed in series with the supply line in both applications to protect the device from reverse polarity switching and from damage caused by pulses 1 and 3 in Figs 7 and 8. In the present application a varistor is included in the motor. The electrolytic capacitor of 47 F should have a very low ESR, for instance as low as 5 at a temperature of -40 C. An extra ceramic capacitor (approximately 100 nF) parallel to it is obligatory when this can not be guaranteed.
handbook, full pagewidth
+Vb 43 V VP1 VP2 47 F
TDA3629
PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE
SUPPLY
SHORT-CIRCUIT ISET +Vb RSET 1 k + VSET - RFB + VFB - FB ISET SET BROKEN WIRE VP Im
OUT1 INPUT STAGE
+Vb 2.2 k
WINDOWS AND COMPARATORS
OUTPUT STAGES VP
+ Vm OUT2
M
-
Iref
MECHANICAL TRANSMISSION
MGE640
Fig.9 Best case application diagram.
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
+Vb 43 V VP1 VP2 47 F 100 nF
TDA3629
PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE
SUPPLY
SHORT-CIRCUIT ISET +Vb RSET 1 k + VSET - RFB + VFB - SET BROKEN WIRE VP Im
OUT1 INPUT STAGE ISET
+Vb 2.2 k
100 nF FB
WINDOWS AND COMPARATORS
OUTPUT STAGES VP
+ Vm OUT2
M
-
100 nF
Iref
MECHANICAL TRANSMISSION
MGE641
Fig.10 Worst case application diagram.
Thermal aspects The dissipation of the device is the sum of two sources: the supply current (IP - Im) times the supply voltage (VP) plus the motor current (Im) times the output saturation voltage (VP - Vm). In formula: P = VP x ( IP - Im ) + Im x ( VP - Vm ) (IP - Im) is approximately equal to IP(ss) when the motor is not running. It is obvious from the ratings that the combination of VP = 18 V, (IP - Im) = 80 mA, Im = 900 mA and (VP - Vm) = 2.5 V can not be allowed at Tamb = 105 C; see chapter "Limiting values" note 2. But it is also improbable that the motor is continuously driven, therefore the following assumptions have been made. 1996 Sep 04 12
It is assumed that the device must be capable of moving the motor from one end to the other in four equal steps and that the total time needed for this excursion is 16 seconds. After this excursion a pause is allowed before the same pulses are used to return to the original position. This operation is illustrated in Fig.11.
Philips Semiconductors
Product specification
Light position controller
Stereo operation
TDA3629
handbook, halfpage
8s 4s pause
active motor inactive time (s)
MGE642
The duration of the pause depends on the ambient temperature, see Table 1.
Fig.11 Thermal transient test.
Table 1
Duration of the pauses Tamb (C) <95 95 95 to 105 PAUSE (s) 60 180 300
The default application will be when two modules are driven by one set potentiometer. One module controls the left head light, where the other one controls the right head light. Each module is connected by three wires: the battery line, the ground line and the set input wire. This can result in two additional fault conditions: from one module the battery line or the ground line can be broken, when the other module is still connected. Assume that the left one operates normally, where the right one has a fault. The setting potentiometer will have extra loading when the battery line is broken. This will result in a lower voltage at the wiper of the setting potentiometer. Thus the left module will start to regulate until a new equilibrium is reached. The amount of extra loading can be influenced by the external series resistor in the set input. These fault conditions and their implications should be considered when the total application is designed. Test diagram All parameters in chapter "Characteristics" until this section are measured at Tamb = 25 C and are tested at each device using the test set-up of Fig.12. The only exceptions are parameters supply current (motor active) and output voltage (motor output) where the 1 k output resistor is replaced by an appropriate current source.
The maximum allowable dissipated power P is then 0.77 W during the motor active periods in the event of a DIP8 package being used. Dissipation pulses due to starting and stopping the motor can be ignored because of their short duration. This maximum allowable dissipated power implies that the maximum continuous motor current (Im) is approximately 250 mA during the motor active periods when the supply voltage VP is 13 V. The maximum allowable dissipated power P is 0.67 W during the motor active periods in the event of a SO16 package being used. This implies that the maximum continuous motor current (Im) is approximately 220 mA during the motor active periods when the supply voltage (VP) is 13 V.
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
VP1
VP2
12 V
+ -
TDA3629
PROTECTION - OVER VOLTAGE - UNDER VOLTAGE - TEMPERATURE
SUPPLY
SHORT-CIRCUIT ISET RSET = 20 k + - VSET RFB = 20 k + - VFB Iref BROKEN WIRE SET VP
OUT1 INPUT STAGE
FB ISET
WINDOWS AND COMPARATORS
OUTPUT STAGES VP OUT2
1 k
MGE643
Fig.12 Test set-up (general).
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
IMMUNITY TO NARROW BAND ELECTROMAGNETIC DISTURBANCES Test procedure GENERAL INFORMATION The immunity is measured using a test procedure, which is derived from the draft international standard "ISO/DIS 11452", parts 1 and 7, submitted for circulation 1992 June 14. The test is carried out using a printed-circuit test board in a test set-up, which is illustrated in Fig.13. The circuit diagram of the test board is shown in Fig.14. The physical layout of the test board is shown in Figs 15 to 17. PREPARATION OF TEST The IC under test is mounted onto the printed-circuit test board. The printed-circuit test board is mounted into the faraday cage (RF-shielded 19 inch-rack) and connected to the test equipment as shown in Fig.13. One of three RF voltage injection points has to be chosen for injection, while the others have to be connected to passive terminations. The injection into the control loop via input RFC is shown in Fig.13. After the set-up is completed, the feedback voltage is selected by the appropriate setting of a jumper in the jumper field J1 (see Fig.14) and the battery voltage is switched on. With no RF voltage injected the correct operation of the system is verified by turning the SET potentiometer (see Fig.13) left and right (or vice-versa). The outputs OUT1 and OUT2 will switch to on-state (absolute differential voltage Vdiff = 3 to 5 V DC) in both turn directions. If the device under test functions correctly, the potentiometer is set to a position where the absolute voltage difference between the slider connection of the potentiometer and the jumper J1 is less than 5 mV. After adjustment, the absolute differential output voltage Vdiff has to be below 100 mV. Having reached this condition the immunity test may be started. TEST OF IMMUNITY For the test of immunity the RF voltage is injected into the test board and Vdiff is monitored for degradation. Vdiff is degraded if its actual value exceeds the maximum value described in Table 2. In the test routine the frequency is varied in steps from the start frequency to the stop frequency (see Table 2). Within each frequency step the level of injected RF voltage is incremented by steps to the maximum test level, which is specified in Table 2. Each step level is held constant for the dwell time. After the dwell time has elapsed, the degradation of the absolute output voltage is checked. If a degradation is detected it 1996 Sep 04 15
TDA3629
has to be verified, because the level setting may have an overshoot and the device under test may have a latching behaviour. The verification is achieved by switching off the power supply for 1 s after degradation is first detected. Then the supply is switched on and the degradation is rechecked. If the second check also indicates a degradation, then the values of RF level and frequency are inserted into a data file for reporting. If the second check is negative the level is further increased. If no degradation occurs until the specified maximum test level is reached, the maximum level is recorded together with the frequency of that step. RECOMMENDED RF-VOLTAGE SETTING PROCEDURE For a fast setting of the RF voltage to the required test level step it is recommended that the substitution method is used. This method sets the actual test level with respect to level values that have been filed in a pre-measurement. The RF source in the test set-up is built from a low-power RF generator and suitable amplifiers. In the recommended pre-measurement the RF voltage at the injection point is measured, while the signal generator outputs a constant voltage level (e.g. 100 mV). Thus, the gain factor from the output of the RF generator to the injection point can be easily calculated. In the pre-measurement the RF voltage at the injection point is measured for each frequency step. Dividing this measured voltage by 100 mV results in the gain factor for this frequency. All gain factors together with their frequency value are filed for use in the level setting of the immunity tests. In the immunity test routine, a required RF voltage test level at a frequency step is obtained by setting the RF signal generator to a level that is calculated by dividing the required RF voltage test level by the gain factor of that frequency. Test conditions The test is carried out using the test procedure as mentioned before and under the conditions mentioned in Table 2.
Philips Semiconductors
Product specification
Light position controller
Table 2 General test conditions for immunity measurements PARAMETER CONDITIONS MIN. TYP. - - 0 - - from 250 kHz to 1 MHz from 1 to 10 MHz; 9 steps (logarithmic): n = 0 to 8 from 10 to 200 MHz from 200 to 1000 MHz VIL(rms) immunity voltage level (RMS value) from 250 kHz to 1 MHz from 1 MHz to 5 MHz from 5 MHz to 1 GHz VTL(max) VSTART(rms) VSTEP(rms) QTL tdwell fM(AM) mD Notes 1. The typical value is 1 x 10
n -9
TDA3629
SYMBOL General Tamb Vbat Vdiff fstart fstop fn
MAX.
UNIT
ambient temperature battery voltage absolute differential output voltage (DC value) start frequency stop frequency frequency steps
18 12.5
28 13.5 1.0 - - 100
oC
V V kHz MHz kHz MHz MHz MHz V V V V V V % s
250 1 000 -
- - - - 5 10 15 - 2 - -10 2 - -
note 1 - - - - - - 24 4 2 - - 2 20 - - - - 6 - +10 - - -
maximum test voltage level voltage start level (RMS value) voltage level step (RMS value) relative accuracy of test level dwell time
RF-voltage characteristic; note 2 AM modulation frequency modulation depth constant peak level constant peak level 1 0 kHz %
2. For definition see "ISO/DIS 11452-1", annex B.
1996 Sep 04
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Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
FARADAY CAGE
LIGHT POSITION CONTROL IMMUNITY TEST BOARD
CONTROL
RFC 100
OUT1 620 50 nF
OUT2
RFG 100
GND
+13 V
RFS 100
50 nF SET 1 k 50 RF
50 Vdiff nF - + V digital 50
50 nF Vbat
50 nF
50
MGE853
RF RF digital V
TEST CONTROL AND DATA AQUISITION
RFC is the RF voltage injection point to control path. RFG is the RF voltage injection point to ground. RFS is the RF voltage injection point to battery voltage (+13 V). For all decoupling filters Z >> 150 .
Fig.13 Test set-up for immunity test.
1996 Sep 04
17
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
+13 V
Vbat C2 47 nF
D1 1N4005 D2 BZT03/C43 n.c. VP1 VP2 n.c. n.c. R1 SET SET 10 2 14 16 IC1 FB 1 TDA3629T 11 OUT2 OUT2 OUT1 6 OUT1 C5 1.0 nF n.c. 5 12 15 C6 47 F (50 V)
RFS R7 1.2 k
CONTROL C3 47 nF RFC R6 820 R5 820 R4 1.2 k GND C4 47 nF RFG J1
15 k C1 R2 FB 100 nF 20 k
n.c. 1 n.c.
3
4 7 8 13 9 n.c. n.c. n.c. GND
R8 510
R9 510
OUT2
OUT1
MGE852
Feedback voltage setting J1: amount of voltage difference between J1 and SET input adjusted by potentiometer setting to <50 mV (see also Fig.13).
Fig.14 Circuit diagram of the test board.
Figs 15 to 17 show the layout of the immunity test board used for the evaluation.
1996 Sep 04
18
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
D1 C6 R7 D2 R6 30 50 70% J1 R2 C2 +13 V RFS R1 C3 R9 R8 C1 IC1 C5
R5
C4 R4 GND RFG
CONTROL
OUT1
OUT2
MGE854 MGE855
Fig.15 Component placement of the printed-circuit board.
handbook, full pagewidth
Fig.16 Top view of printed-circuit board.
1996 Sep 04
19
RFC
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
MGE856
Fig.17 Bottom view of printed-circuit board.
Test results
MGE858
handbook, full pagewidth
30
VRF(rms) (V)
20 (1)
device accepted device not accepted
(2) 10 (3)
(4)
0 10-1
1
10
102
frequency (MHz)
103
(1) Feedback voltage is 30%. (2) Feedback voltage is 50%. (3) Feedback voltage is 70%. (4) Immunity level.
Fig.18 Typical immunity results with respect to setting of jumper 1 (30, 50 and 70%) RF input to RFC.
1996 Sep 04
20
Philips Semiconductors
Product specification
Light position controller
TDA3629
handbook, full pagewidth
30
MGE857
VRF(rms) (V) (1) 20
device accepted device not accepted (2) 10
(3)
0 10-1
1
10
102
frequency (MHz)
103
(1) RF voltage injection point to ground and to battery voltage. (2) RF voltage injection point to control path. (3) Immunity level.
Fig.19 Typical immunity results with respect to RF injection points, with jumper 1 set to 50%.
The typical immunity results of the TDA3629T are shown in Fig.18. The RF voltage was injected into the control line (see also Figs 13 and 14). This injection point is the most sensitive one that could be found. This is underlined by the comparison results shown in Fig.19.
1996 Sep 04
21
Philips Semiconductors
Product specification
Light position controller
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA3629
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1996 Sep 04
22
Philips Semiconductors
Product specification
Light position controller
TDA3629
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z
16 9
Q A2 pin 1 index Lp
1 8
A1
(A 3)
A
L wM detail X
e
bp
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 0.24 0.23 L 1.05 0.041 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.0098 0.057 0.0039 0.049
0.019 0.0098 0.39 0.014 0.0075 0.38
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 91-08-13 95-01-23
1996 Sep 04
23
Philips Semiconductors
Product specification
Light position controller
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA3629
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Sep 04
24
Philips Semiconductors
Product specification
Light position controller
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA3629
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Sep 04
25
Philips Semiconductors
Product specification
Light position controller
NOTES
TDA3629
1996 Sep 04
26
Philips Semiconductors
Product specification
Light position controller
NOTES
TDA3629
1996 Sep 04
27
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA51
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
617021/1200/01/pp28
Date of release: 1996 Sep 04
Document order number:
9397 750 01139

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